• CL 201209

    Feature:

  • 􀂻 Monolithic structure for highly reliable surface mount applications.
    􀂻 Excellent solderability and high heat resistance for either flow or reflow soldering.
    􀂻 No cross coupling between inductors due to magnetic shield. Ideal for high density installation.
    􀂻 Superior Q characteristics guaranteed over the wide frequency allow high frequency application.
    􀂻 Dimensions are suitable for automatic mounting. 

DataSheet
Part No. Part Description Sampling Inquiry
CL 201209-2R2 U

2.2uH,650mOhm,0.03A, Chip Inductor,1.1mm max height 
CL 201209-1R8 U

1.8uH,600mOhm,0.05A, Chip Inductor,1.1mm max height 
CL 201209-1R5 U

1.5uH,500mOhm,0.05A, Chip Inductor,1.1mm max height 
CL 201209-1R2 U

1.2uH,500mOhm,0.05A, Chip Inductor,1.1mm max height 
CL 201209-1R0 U

1.0uH,400mOhm,0.05A, Chip Inductor,1.1mm max height 
CL 201209-R82 U

0.82uH,1000mOhm,0.15A, Chip Inductor,1.1mm max height 
CL 201209-R68 U

0.68uH,800mOhm,0.15A, Chip Inductor,1.1mm max height 
CL 201209-R56 U

0.56uH,750mOhm,0.15A, Chip Inductor,1.1mm max height 
CL 201209-R47 U

0.47uH,650mOhm,0.20A, Chip Inductor,1.1mm max height 
CL 201209-R39 U

0.39uH,650mOhm,0.20A, Chip Inductor,1.1mm max height 
CL 201209-R33 U

0.33uH,550mOhm,0.25A, Chip Inductor,1.1mm max height 
CL 201209-R27 U

0.27uH,500mOhm,0.25A, Chip Inductor,1.1mm max height 
CL 201209-R22 U

0.22uH,500mOhm,0.25A, Chip Inductor,1.1mm max height 
CL 201209-R18 U

0.18uH,400Ohm,0.25A, Chip Inductor,1.1mm max height 
CL 201209-R15 U

0.15uH,400mOhm,0.25A, Chip Inductor,1.1mm max height 
CL 201209-R12 U

0.12uH,300mOhm,0.25A, Chip Inductor,1.1mm max height 
CL 201209-R10 U

0.10uH,300mOhm,0.25A, Chip Inductor,1.1mm max height 
CL 201209-68N U

0.068uH,200mOhm,0.3A, Chip Inductor,1.1mm max height 
CL 201209-47N U

0.047uH,200mOhm,0.3A, Chip Inductor,1.1mm max height 
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